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高功率元件應用研發聯盟

半導體長晶及磊晶、元件設計與製程、模組封裝、產品應用

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2016功率半導體材料(氮化鎵&碳化矽)應用元件國際論壇

2016功率半導體材料(氮化鎵&碳化矽)應用元件國際論壇

2016 Symposium on High Power Semiconductor Materials (GaN & SiC) and Devices

Invitation

 

 

次世代電力電子製造技術為全球製造業創新研究發展重點之一,矽基元件是過去幾十年來世界經濟發展的重要推手,但由於矽(Si)已接近其理論上的性能極限,寬能隙(Wide Bandgap; WBG)半導體材料與電力電子元件日趨重要,將成為次世代功率產品及應用重要的技術平台。

     我國投入寬能隙高功率材料與模組製程研究多年,建立與國際功率模組產業之技術交流平台實屬必要,本研討會特邀請國內外功率半導體產學機構,包括Infineon Technologies、Transphorm Inc、STMicroelectronics、台達電子、全鑫材料、漢磊科技及交通大學專家進行專題演講,與國內各界分享交流,在此,誠摯邀請您撥冗參加此盛會,並藉此機會與國內相關產業先進作技術及經驗交流,期能促成上下游廠商的合作結盟,紮根台灣,跨足國際

 

The power electronics semiconductor manufacturing technology of next generation has been the global manufacturing innovation researching and developing emphasis. Si-based components are important for global economic development in last few decades. However, the performance of Si is almost approaching its limit; meanwhile, Wide Bandgap semiconductor components and power electronics components become more important, and will be the significant technology platform for power products and applications of next generation.

Taiwan has been engaging in the development of semiconductor industry for years, founding a platform that provides technical information exchange and collaboration for international communities is important and necessary. We are honored to invite domestic and foreign experts in the industry and academia of power semiconductor, including Infineon Technologies, Transphorm Inc, STMicroelectronics, DELTA, AG materials Inc., EPISIL technology Inc. and NCTU to deliver lectures and share information.

Sincerely invite you to participate this symposium, we aim to provide a platform where experiences exchanges and facilitate the collaboration among supply chain manufacturers. This symposium is expected to be a momentum for high power semiconductor materials and modules technology development in Taiwan, and international.

 

 

  • 論壇時間Symposium time
  • 年10月13日 上午8:30至下午5:00 (Oct.13rd.2016,8:30am~5:00pm)

 

  • 活動報名時間Registration time
  • 2016年9月30日下午五點止(額滿為止) (From now until Sep.30th .2016 5:00pm, until Full)

 

 

  • 議程Agenda

Thursday, October 13, 2016

8:30-9:00

Registration

9:00-9:10

Opening Remarks

9:10-9:50

The impact of GaN and SiC on the density and performance of power electronics

Infineon Technologies

Dr. Eric Persson

Head of GaN Applications

9:50-10:30

SiC MOSFET design for high power application

Delta Electronics, Inc.

Dr. Herman Chang

General Manager

10:30-10:50

Coffee Break

10:50-11:30

Materials Design Aspects for Power Electronic System

AG materials Inc.

Dr. Mannfu Rau

President

11:30-12:00

Panel Discussion

12:00-13:20

Lunch

13:20-14:00

GaN MISHEMT for Power Switching Applications : Materials and Process Aspects

National Chiao Tung University

Dr. Edward Y. Chang

Vice president

14:00-14:40

Today and the Future of GaN HEMTs for Power Conversion

Transphorm Inc.

Dr. Primit Parikh

Cofounder & President

14:40-15:00

Coffee Break

15:00-15:40

Commercialization of SiC power device production line

Episil Holding Inc.

Dr. Ian Chan

CEO

15:40-16:20

lectures

STMicroelectronics

Dr. Giuseppe Izzo

General Manager and Regional Vice President

16:20-17:00

Panel Discussion

18:00-20:00

Banquet

Friday, October 14, 2016

9:30-11:30

Expert forum (Closed meeting)

11:30-13:00

Lunch

  • 線上報名網址Registration website http://ppt.cc/B7H2K
  • 論壇地點Symposium venue:R301 (NTUH International Convention Center, Taipei, Taiwan R301)2號 (No.2, Xuzhou Rd., Zhongzheng Dist., Taipei City 10055, Taiwan, R.O.C.)
  • 主辦單位Organized by:National Chung-Shan Institute of Science & Technology、Taiwan Institute of Economic Research
  • 會議連絡人Contact
  • Taiwan Institute of Economic Research
  • Shain Lee  phone: +886-2-2586-5000 ext. 941   e-mail: d32955@tier.org.tw
  • :10461台北市德惠街16-8號7樓 (7F., No. 16-8, Dehuei St., Jhongshan District, Taipei City 10461, Taiwan)

2016功率半導體材料(氮化鎵&碳化矽)應用元件國際論壇

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