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::: 可授權專利

MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME(微電子三維建構裝技術)

創作型式:
發明
專利證號:
US9288907B2
發明人:
洪國洋、楊令樂、趙本善、陳堃峯、劉維欽、胡紹俊、許履塵
國別:
美國
獲證日期:
2016/03/15
專利摘要:
A device for measuring distribution of thermal field in a crucible comprises a crucible comprising an upper lid, a body, a growth chamber and a material source zone; a thermally insulating material disposed outside the crucible; a movable heating component for heating the crucible; a plurality of thermocouples enclosed by insulating, high temperature resistant material and disposed in the crucible after being inserted into a plurality of holes on the upper lid to measure distribution of thermal field in the crucible. The thermocouples enclosed by insulating, high temperature resistant material are effective in measuring and adjusting temperature distribution in the crucible to achieve optimal temperature distribution for crystal growth in the crucible.
IPC國際分類號:
C23C001424