::: 產業服務
*

::: 技術移轉

專利名稱 批式落串式除揮份器之設計法Method of Batch Falling Strand Devolatilizer
創作型式 發明
專利證號 US7822583B2
國別 美國
獲證日期 2010/10/26
專利摘要 A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.

IPC國際分類號

H01L002312
聯絡人 王淳右
電話 #329566
EMAIL f437frank@ncsist.org.tw