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專利名稱 MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME(微電子三維建構裝技術)
創作型式 發明
專利證號 US9288907B2
國別 美國
獲證日期 2016/03/15
專利摘要 A device for measuring distribution of thermal field in a crucible comprises a crucible comprising an upper lid, a body, a growth chamber and a material source zone; a thermally insulating material disposed outside the crucible; a movable heating component for heating the crucible; a plurality of thermocouples enclosed by insulating, high temperature resistant material and disposed in the crucible after being inserted into a plurality of holes on the upper lid to measure distribution of thermal field in the crucible. The thermocouples enclosed by insulating, high temperature resistant material are effective in measuring and adjusting temperature distribution in the crucible to achieve optimal temperature distribution for crystal growth in the crucible.

IPC國際分類號

C23C001424
聯絡人 王淳右
電話 #329566
EMAIL f437frank@ncsist.org.tw