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專利名稱 Method for improving adhesion between ceramic carrier and thick film circuit(一種提升陶瓷載板與厚膜電路附著力之方法)
創作型式 發明
專利證號 US10362684
國別 美國
獲證日期 2019/07/23
專利摘要 The present invention relates to a method for improving adhesion between ceramic and a thick film circuit. The method is particularly directed to accelerate the formation of a ceramic-metal eutectic phase between the ceramic carrier and the metal circuit by solid-phase diffusion bonding under a positive atmosphere. A metallic conductive slurry or its oxide slurry is printed on the surface of the ceramic carrier to form a circuit pattern by a thick film screen printing. The ceramic carrier is placed in an oven with temperature controlled by a program under a positive-pressure atmosphere of an inert gas including nitrogen, hydrogen or their mixtures. An eutectic phase is formed between the ceramic carrier and the metal circuit under a high temperature eutectic condition to increase the adhesion between the ceramic carrier and the thick film circuit.

IPC國際分類號

B32B001800
聯絡人 王淳右
電話 #329566
EMAIL f437frank@ncsist.org.tw