| 專利摘要 | The present invention provides an anti-shock pad, which includes: a board-shaped compound material structure, manufactured by mixing a composition and foam molding the composition, wherein the composition comprises: a main substrate, having a proportion of 50 wt % to 80 wt % of total weight of the composition, comprising: a vinyl acetate; and an ethylene-vinyl acetate; a secondary substrate, having a proportion of 10 wt % to 40 wt % of the total weight of the composition, comprising: a polyethylene; a styrene butadiene rubber; and a thermoplastic elastomer; and an additive, having a proportion of 1 wt % to 20 wt % of the total weight of the composition; wherein a density of the anti-shock pad is between 0.20 and 0.50, and a foaming ratio of the anti-shock pad is between 20 and 40. The present invention is also related to a method of manufacturing the anti-shock pad. |