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::: 技術移轉

專利名稱 Method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts
專利證號 US7270732B2
國別 美國
獲證日期 2007-09-18
專利摘要 A method for enhancing bonding strength of a metal spraying thickened layer of electroformed mold inserts includes the following procedures: forming a plurality of stereoscopic reinforced ribs on an electroformed metal shell mold by metal spraying; covering the stereoscopic reinforced ribs and the electroformed metal shell mold to become an integrated body by electroforming; forming a metal thickened layer by metal spraying; forming a second electroformed cover and forming a metal key bond between the electroformed cover and the metal thickened layer. The method of the invention can shorten fabrication time of the electroformed mold insert and improve the mechanical strength and soldering affinity of the metal thickened layer.

IPC國際分類號

C25D000110