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論文
【年度】99
年研發成果
【項目】
論文
【領域】
軍品釋商科專
【類別】
生醫材化
| 計畫名稱 | 材料與化工領域軍品釋商第三期計畫 | | 論文名稱 | Preparation And Characteristics Of High-Temperature Epoxy-Phenolic Adhesive Film For Bonding Metal And Reinforced Composites(澳亞地區複材研討會發表論文) | | 論文類型 | 研討會 | | 發表處 | 7th Australasian conference on composite materials | | 發表人 | 卓錫樑、揚令樂、余仁斌、莊達平、王正煥 | | 發表日期 | 99/09/17 | | 國家 | 國內 | | 內容摘要 | "A family of aluminum powder filled epoxy-phenolic resins were prepared and characterized over a broad range of phenolic/epoxy/aluminum weight ratios. The effect of the filler on the thermal properties of the cured resin was studied by using thermogravimetric analysis and the results show that the thermal stability of filled polymer is significantly greater than that of unfilled one. These aluminum filled epoxy-phenolic resins were coated on a glass fabric carrier to form a tape adhesive. The tape adhesive joint strengths, containing wide range of adhesions, between the E-glass fabric reinforced phenolic composite and 17-4PH stainless steel plate were measured at room temperature and 280°C respectively. The inspection of delamination of the adhesive by using ultrasonic was performed for wide range of adhesions using a 3 : 2 aluminum/epoxy- phenolic resin blend. An optimum adhesive strength was obtained for epoxy-phenolic resin system at a certain epoxy/phenolic weight ratio and no delamination phenomenon was found. " |
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