| 計畫名稱 | 智慧綠能電子/車電關鍵技術計畫 |
| 論文名稱 | The Eutectic Bonding Reliability Improvement of Vertical Power LEDs by a Mo buffer layer |
| 論文類型 | 研討會 |
| 發表處 | TACT 2013 International Thin Films Conference |
| 發表人 | Ting-Wei You, Chia-Yi Yen, Liann-Be Chang, Ming-Jer Jeng, Chun-Te Wu , Sung-Cheng Hu, Yang-Kuao Kuo |
| 發表日期 | 102/10/05 |
| 國家 | 國內 |
| 內容摘要 | Light emitting diodes (LED) has become a mainstream device in the next generation of solid-state lighting. The reliability of LED lighting becomes an interesting research topic. The reliability is strongly related with its heat dissipation capability espe |