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論文
【年度】103
年研發成果
【項目】
論文
【領域】
關鍵技術科專
【類別】
電資通光
| 計畫名稱 | 智慧綠能電子/車電關鍵技術計畫 | | 論文名稱 | 開發新穎之化學機械研磨用於氧化物薄膜上的奈米鑽石平面修整器 | | 論文類型 | SCI期刊 | | 發表處 | Journal of the Chinese Society of Mechanical Engineers, Vol.35, No.2, pp 141~148(2014) | | 發表人 | Jihng Kuo Ho, Che Hsiung Tsai, Ming Yi Tsai,Jui Hsuan Chiang | | 發表日期 | 2014/06/01 | | 國家 | 國內 | | 內容摘要 | ions, which enables their uniform dispersion in the polyurethane matrix. The surface characteristics and contact angle of the nanodiamond-impregnated pads, as well as the removal rate of a dielectric oxide film polished with these pads, were investigated and compared with the corresponding attributes shown by a polyurethane polishing pad. The results of this study confirmed that the nanodiamond-impregnated polishing pads showed the smallest contact angle for the slurry, indicating that their ability to retain the slurry was better than that of a polyurethane polishing pad. Hence, the site to be polished was better lubricated by increasing its wetting, which led to a faster polishing of the wafer without damaging the local circuitry by the nanodiamond-impregnated pads. Thus, oxide CMP tests proved that these novel polishing pads provided a better wafer removal rate. |
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