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論文
【年度】103
年研發成果
【項目】
論文
【領域】
關鍵技術科專
【類別】
電資通光
| 計畫名稱 | 智慧綠能電子/車電關鍵技術計畫 | | 論文名稱 | Development and Analysis of Double-Faced Radial and Cluster-Arranged CMP Diamond Disk | | 論文類型 | SCI期刊 | | 發表處 | Mathematical Problems in Engineering | | 發表人 | M. Y. Tsai C. H. Chen and T. S. Yeh, | | 發表日期 | 2014/08/31 | | 國家 | 國外 | | 內容摘要 | In semiconductor manufacturing, diamond disks are indispensable for dressing chemical mechanical polishing (CMP) pads. Recently, 450mm(18 inch) diameter wafers have been used to improve output and reduce wafer production cost. To polish 450mm diameter wafers, the diameter of polishing pads must be increased to 1050 mm. In particular, because diamond disks are limited to 100mmdiameters, amuch greater number of working crystals will be required for dressing a 1050mmdiameter pad. Consequently, new diamond disks must be developed. In this study, novel arrangements are made using a braze in diamond patterns, which are radial with a cluster arrangement of 3-4 grits per cluster. Furthermore, a double-faced combined diamond disk is developed. The polishing pad surface was characterized, and the effect of different diamond conditioners on wafer removal rate was studied. This research aims to develop a more suitable diamond disk for dressing 1050mm diameter polishing pads. |
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