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::: 技術移轉

C25：電解或電泳工藝；其所用的設備

相關專利

項次專利名稱專利證號
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2强化電鑄模仁熔射增厚層結合强度之方法I245813
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5PREPARING METHOD FOR COATING PMMA PARTICLES WITH SILICON DIOXIDEUS8354138B2
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10具微結構模仁與其製造裝置及製造方法APPARATUS AND METHOD FOR PRODUCING MICRO-STRUCTURE MOLDI320807
11具有無色金屬光澤及防蝕效果之鋁合金鑄材/引伸材銲接組件陽極處理A ANODIZING TREATMENT FOR A CAST/EXTRUSION ALUMINUM ALLOY WELDING PART WITH COLOURLESS BRIGHT CHARACTERISTICS AND CORROSION RESISTANCEI242057
12超薄銅電鑄層的製造方法METHOD FOR PRODUCING AN ULTRA-THIN ELECTROFORMED COPPERI228155
13利用陽極處理改善富鈦之鈦鋁介金屬的高溫耐氧化207408
14低應力的鎳鎢合金電鑄113460
15具非均勻磁場强度之金屬件的製造方法METALS WITH IMHOMOGENEOUS MAGNETIC FIELD STRENGTHI304843
16電沉積鋅極及其製程ELECTRO-DEPOSITING ZINC ELECTRODE AND PROCESS THEREOFI247825
17電沉積鋅極及其製程TWI247825
18強化電鑄模仁熔射增厚層結合強度之方法TWI245813
19非氰系銀電鍍液組成物TWI440744
20氮化鋁基板厚銅覆銅之製備方法TWI512150
21用於半導體導線的銅銀雙成分金屬電鍍液體及電鍍方法TWI647342
22一種製備大面積雙功能觸媒電極的方法TWI717070
23Copper-silver dual-component metal electroplating solution and electroplating method for semiconductor wire (用於半導體導線的銅銀雙成分金屬電鍍液體及電鍍方法)US10329681